下载
Silicon Spreading Resistance Temperature Sensor in Miniature Leaded Plastic Package
Features
KT 110, KT 210, KTY 11, KTY 21
? Temperature dependent Resistor with Positive Temperature Coefficient ? Miniature plastic package for very small thermal time constants ? Fast response ? High reliability due to multilayer gold contacts ? n-conducting silicon crystal TO-92 Mini ? Polarity independent due to symmetrical construction ? Available selected in ? 1% tolerance groups (KTY-series) Type KT 110 KTY 11-5 KTY 11-6 KTY 11-7 KT 210 KTY 21-5 KTY 21-6 KTY 21-7 Marking T-1 T-5 T-6 T-7 N-1 N-5 N-6 N-7 Ordering Code Q62705-K332 Q62705-K245 Q62705-K246 Q62705-K247 Q62705-K334 Q62705-K258 Q62705-K259 Q62705-K260 Pin Configuration 1 electrical contact 2 electrical contact TO-92 Mini Package
Absolute Maximum Ratings Parameter Maximum operating voltage 1) TA 25 ?C, t 10 ms Maximum operating current Peak operating current TA 25 ?C, t 10 ms Operating temperature range Storage temperature range
1)
Symbol
KT 110 KTY 11
KT 210 KTY 21 25
Unit V mA mA ?C ?C
Vopmax Iopmax Iopp Top Tstg
5 7
7 10 - 50 ... + 150 - 50 ... + 150
ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks.
Semiconductor Group
1
1997-09-30
KT 110, KT 210, KTY 11, KTY 21
Electrical Characteristics at TA = 25 ?C unless otherwise specified Parameter Symbol min. Temperature sensor resistance IB = 1 mA R25 KT 110 KTY 11-5 KTY 11-6 KTY 11-7 KT 210 KTY 21-5 KTY 21-6 KTY 21-7 Thermal time constant (63% of TA) in still air in still oil (Freon FC40/PP7) Package Outline TO-92 Mini air oil 1940 1950 1980 2010 970 975 990 1005 ? ? Limit Values typ. ? ? ? ? ? ? ? ? 11 1.5 max. 2060 1990 2020 2050 1030 995 1010 1025 s ? ? Unit
2.1-0.2 1 1.9-0.2 2 (1.9) 1.7-0.2 10? 0.2 +0.07 -0.03
Dimensions in mm
0.928
0.5 ?0.1 0.4 ?0.1 14.1
0.9 ?0.1
Weight approx. 0.02 g
Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book "Package Information". Semiconductor Group 2 1997-09-30
